W2Z1M72SJ28BC
vs
GS8642Z72C-250MT
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
GSI TECHNOLOGY
|
| Package Description |
PLASTIC, BGA-209
|
LBGA,
|
| Reach Compliance Code |
unknown
|
compliant
|
| Access Time-Max |
2.8 ns
|
6.5 ns
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3.3V SUPPLY
|
| JESD-30 Code |
R-PBGA-B209
|
R-PBGA-B209
|
| Length |
22 mm
|
22 mm
|
| Memory Density |
75497472 bit
|
75497472 bit
|
| Memory IC Type |
SRAM MODULE
|
ZBT SRAM
|
| Memory Width |
72
|
72
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
209
|
209
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
1MX72
|
1MX72
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.5 mm
|
1.7 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
209
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.32.00.41
|
|
|
|
Compare W2Z1M72SJ28BC with alternatives
Compare GS8642Z72C-250MT with alternatives