W2Z1M72SJ28BC vs GS8642V72C-167I feature comparison

W2Z1M72SJ28BC White Electronic Designs Corp

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GS8642V72C-167I GSI Technology

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP GSI TECHNOLOGY
Package Description PLASTIC, BGA-209 LBGA,
Reach Compliance Code unknown compliant
Access Time-Max 2.8 ns 8 ns
Additional Feature PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B209 R-PBGA-B209
Length 22 mm 22 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type SRAM MODULE CACHE SRAM
Memory Width 72 72
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX72 1MX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.5 mm 1.7 mm
Supply Voltage-Max (Vsup) 2.625 V 2 V
Supply Voltage-Min (Vsup) 2.375 V 1.6 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Part Package Code BGA
Pin Count 209
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Moisture Sensitivity Level 3

Compare W2Z1M72SJ28BC with alternatives

Compare GS8642V72C-167I with alternatives