W29N08GVBJAF vs MT29F8G08ABACAWP-AIT:CTR feature comparison

W29N08GVBJAF Winbond Electronics Corp

Buy Now Datasheet

MT29F8G08ABACAWP-AIT:CTR Micron Technology Inc

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description VFBGA, TSOP1-48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Data Retention Time-Min 10
JESD-30 Code R-PBGA-B63 R-PDSO-G48
Length 11 mm 18.4 mm
Memory Density 8589934592 bit 8589934592 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 63 48
Number of Words 1073741824 words 1073741824 words
Number of Words Code 1000000000 1000000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1GX8 1GX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TSOP1
Package Equivalence Code BGA63,10X12,32 TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3.3 V
Seated Height-Max 1 mm 1.2 mm
Standby Current-Max 0.00005 A 0.0001 A
Supply Current-Max 0.035 mA 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Type SLC NAND TYPE SLC NAND TYPE
Width 9 mm 12 mm
Write Cycle Time-Max (tWC) 0.025 ms
Base Number Matches 1 1
Command User Interface YES
Data Polling NO
Endurance 60000 Write/Erase Cycles
Number of Sectors/Size 4K
Page Size 4K words
Ready/Busy YES
Sector Size 256K
Toggle Bit NO

Compare W29N08GVBJAF with alternatives

Compare MT29F8G08ABACAWP-AIT:CTR with alternatives