W29F102Q-45
vs
M29F102BB45N1E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
NUMONYX
Part Package Code
TSOP
TSOP
Package Description
TSOP1,
10 X 14 MM, LEAD FREE, PLASTIC, TSOP-40
Pin Count
40
40
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
45 ns
45 ns
Additional Feature
HARDWARE DATA PROTECTION; 10 YEARS DATA RETENTION
BOTTOM BOOT BLOCK
Data Retention Time-Min
10
JESD-30 Code
R-PDSO-G40
R-PDSO-G40
Length
12.4 mm
12.4 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX16
64KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
10 mm
10 mm
Base Number Matches
2
1
Boot Block
BOTTOM
JESD-609 Code
e3/e6
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN/TIN BISMUTH
Time@Peak Reflow Temperature-Max (s)
40
Compare W29F102Q-45 with alternatives
Compare M29F102BB45N1E with alternatives