W29C011AP15N
vs
CAT28LV64GI-15
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
WINBOND ELECTRONICS CORP
ON SEMICONDUCTOR
Part Package Code
QFJ
QFJ
Package Description
QCCJ, LDCC32,.5X.6
QCCJ, LDCC32,.5X.6
Pin Count
32
32
Reach Compliance Code
compliant
compliant
Access Time-Max
150 ns
150 ns
Command User Interface
NO
NO
Data Polling
YES
YES
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e0
e3
Length
13.97 mm
13.97 mm
Memory Density
1048576 bit
65536 bit
Memory IC Type
FLASH
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
8192 words
Number of Words Code
128000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX8
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC32,.5X.6
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Page Size
128 words
32 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Power Supplies
5 V
3.3 V
Programming Voltage
5 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.56 mm
3.55 mm
Standby Current-Max
0.0001 A
0.0001 A
Supply Current-Max
0.05 mA
0.008 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Toggle Bit
YES
YES
Type
NOR TYPE
Width
11.43 mm
11.43 mm
Write Cycle Time-Max (tWC)
10 ms
5 ms
Base Number Matches
2
3
Factory Lead Time
4 Weeks
Endurance
100000 Write/Erase Cycles
Compare W29C011AP15N with alternatives
Compare CAT28LV64GI-15 with alternatives