W26A04B-70LE
vs
IS62UR12816LL-100B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA48,6X8,30
MINI, BGA-48
Pin Count
48
48
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
100 ns
I/O Type
COMMON
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e1
e0
Length
8 mm
Memory Density
4194304 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
262144 words
131072 words
Number of Words Code
256000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-20 °C
Organization
256KX16
128KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
BGA
Package Equivalence Code
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Standby Voltage-Min
1 V
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
1.95 V
2.7 V
Supply Voltage-Min (Vsup)
1.65 V
2.3 V
Supply Voltage-Nom (Vsup)
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
Base Number Matches
1
1
Rohs Code
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