W25X80VDAIZ vs M25PX32SOVMP3TB feature comparison

W25X80VDAIZ Winbond Electronics Corp

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M25PX32SOVMP3TB Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Part Package Code DIP
Package Description DIP, DIP8,.3 6 X 5 MM, ROHS COMPLIANT, VFQFP-8
Pin Count 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Additional Feature SYNCHRONOUS MODE ALSO POSSIBLE
Clock Frequency-Max (fCLK) 33 MHz 75 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDIP-T8 R-PDSO-N8
JESD-609 Code e3
Length 9.14 mm 6 mm
Memory Density 8388608 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 4194304 words
Number of Words Code 1000000 4000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 4MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP HVSON
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 2.7 V
Qualification Status Not Qualified
Seated Height-Max 4.45 mm 1 mm
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 7.62 mm 5 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 1 1

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