W25X64BVDAIG vs S25FL064P0XMFB003 feature comparison

W25X64BVDAIG Winbond Electronics Corp

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S25FL064P0XMFB003 Cypress Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP
Package Description 0.300 INCH, GREEN, PLASTIC, DIP-8 SOP-16
Pin Count 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.B.1.A
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 80 MHz 104 MHz
JESD-30 Code R-PDIP-T8 R-PDSO-G16
Length 9.27 mm 10.3 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 16
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Seated Height-Max 5.33 mm 2.65 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 7.62 mm 7.5 mm
Base Number Matches 1 2
Date Of Intro 2016-08-18
JESD-609 Code e3
Screening Level AEC-Q100
Serial Bus Type QSPI
Terminal Finish MATTE TIN

Compare W25X64BVDAIG with alternatives

Compare S25FL064P0XMFB003 with alternatives