W25X16-VSSI
vs
W25P16-VSSI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
8
8
Reach Compliance Code
unknown
unknown
Clock Frequency-Max (fCLK)
33 MHz
25 MHz
JESD-30 Code
S-PDSO-G8
S-PDSO-G8
JESD-609 Code
e0
e0
Length
5.283 mm
5.283 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX1
16MX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
240
240
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.16 mm
2.16 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
5.283 mm
5.283 mm
Base Number Matches
6
4
Compare W25X16-VSSI with alternatives
Compare W25P16-VSSI with alternatives