W25Q80DVSNIGT
vs
MX29LV320EBXEI-70G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
MACRONIX INTERNATIONAL CO LTD
|
| Package Description |
SOP,
|
6 X 8 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, EIAJ, MO-219, LFBGA-48
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Alternate Memory Width |
1
|
8
|
| Clock Frequency-Max (fCLK) |
104 MHz
|
|
| Data Retention Time-Min |
20
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-PBGA-B48
|
| JESD-609 Code |
e3
|
e1
|
| Length |
4.85 mm
|
8 mm
|
| Memory Density |
8388608 bit
|
33554432 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
48
|
| Number of Words |
1048576 words
|
2097152 words
|
| Number of Words Code |
1000000
|
2000000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1MX8
|
2MX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LFBGA
|
| Package Equivalence Code |
SOP8,.25
|
BGA48,6X8,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Parallel/Serial |
SERIAL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Seated Height-Max |
1.75 mm
|
1.3 mm
|
| Serial Bus Type |
QSPI
|
|
| Standby Current-Max |
0.00006 A
|
0.000015 A
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
3.9 mm
|
6 mm
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
48
|
| Factory Lead Time |
|
12 Weeks
|
| Access Time-Max |
|
70 ns
|
| Boot Block |
|
BOTTOM
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
YES
|
| Data Polling |
|
YES
|
| Number of Sectors/Size |
|
8,63
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
8K,64K
|
| Supply Current-Max |
|
0.03 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
| Toggle Bit |
|
YES
|
|
|
|
Compare W25Q80DVSNIGT with alternatives
Compare MX29LV320EBXEI-70G with alternatives