W25Q80BVZPBP vs W25Q80DVBYIG feature comparison

W25Q80BVZPBP Winbond Electronics Corp

Buy Now Datasheet

W25Q80DVBYIG Winbond Electronics Corp

Buy Now Datasheet
Part Life Cycle Code Active Active
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Package Description HVSON, WLCSP-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
JESD-30 Code R-PDSO-N8 R-PBGA-B8
Length 6 mm 1.73 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Screening Level AEC-Q100
Seated Height-Max 0.8 mm 0.476 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD BALL
Terminal Pitch 1.27 mm 0.4 mm
Terminal Position DUAL BOTTOM
Width 5 mm 1.432 mm
Base Number Matches 1 1
Rohs Code Yes
Samacsys Manufacturer Winbond
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Moisture Sensitivity Level 3
Package Equivalence Code BGA8,2X4,16
Serial Bus Type SPI
Standby Current-Max 0.00006 A
Supply Current-Max 0.025 mA
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

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