W25Q80BVSNBG
vs
W25Q80BWSNIG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Package Description
SOIC-8
SOP, SOP8,.25
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
104 MHz
80 MHz
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
4.9 mm
4.9 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX8
1MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
1.8 V
Screening Level
AEC-Q100
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
1.95 V
Supply Voltage-Min (Vsup)
2.7 V
1.65 V
Supply Voltage-Nom (Vsup)
3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
3.9 mm
Base Number Matches
1
1
Part Package Code
SOIC
Pin Count
8
Samacsys Manufacturer
Winbond
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
Package Equivalence Code
SOP8,.25
Qualification Status
Not Qualified
Serial Bus Type
SPI
Standby Current-Max
0.000005 A
Supply Current-Max
0.025 mA
Type
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
Compare W25Q80BVSNBG with alternatives
Compare W25Q80BWSNIG with alternatives