W25Q64JVZEJM vs M25PX64-VME3E feature comparison

W25Q64JVZEJM Winbond Electronics Corp

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M25PX64-VME3E Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description WSON-8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Date Of Intro 2018-04-03
Samacsys Manufacturer Winbond
Additional Feature IT ALSO OPERATES AT 2.7V @ 104MHZ
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 133 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-N8
Length 8 mm
Memory Density 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 8
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Organization 8MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Equivalence Code SOLCC8,.3
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V 2.7 V
Seated Height-Max 0.8 mm
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 6 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 2 2

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