W25Q64JVXGJM
vs
M25PX64STVME6P
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
MICRON TECHNOLOGY INC
|
| Package Description |
HVSON,
|
SON, SOLCC8,.3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Date Of Intro |
2018-04-03
|
|
| Samacsys Manufacturer |
Winbond
|
|
| Additional Feature |
IT ALSO OPERATES AT 2.7V @ 104MHZ
|
|
| Alternate Memory Width |
1
|
|
| Clock Frequency-Max (fCLK) |
133 MHz
|
75 MHz
|
| Data Retention Time-Min |
20
|
|
| Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
S-PDSO-N8
|
R-PDSO-N8
|
| Length |
4 mm
|
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
8
|
| Number of Words |
8388608 words
|
8388608 words
|
| Number of Words Code |
8000000
|
8000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8MX8
|
8MX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
SON
|
| Package Equivalence Code |
SOLCC8,.16,32
|
SOLCC8,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programming Voltage |
3 V
|
|
| Seated Height-Max |
0.5 mm
|
|
| Serial Bus Type |
SPI
|
SPI
|
| Standby Current-Max |
0.00005 A
|
0.00001 A
|
| Supply Current-Max |
0.025 mA
|
0.015 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
4 mm
|
|
| Write Protection |
HARDWARE/SOFTWARE
|
HARDWARE/SOFTWARE
|
| Base Number Matches |
1
|
2
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare W25Q64JVXGJM with alternatives
Compare M25PX64STVME6P with alternatives