W25Q64JVSSJMTR
vs
M25PX64SOVZM3EB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
MICRON TECHNOLOGY INC
Package Description
,
6 X 8 MM, ROHS COMPLIANT, TBGA-24
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
2.7V TO 3V @ 104MHZ
Clock Frequency-Max (fCLK)
133 MHz
75 MHz
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
JESD-30 Code
S-PDSO-G8
R-PBGA-B24
Length
5.23 mm
8 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
24
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TBGA
Package Equivalence Code
SOP8,.3
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
2.7 V
Seated Height-Max
2.16 mm
1.2 mm
Serial Bus Type
QSPI
Standby Current-Max
0.00005 A
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
DUAL
BOTTOM
Type
NOR TYPE
Width
5.23 mm
6 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
Rohs Code
Temperature Grade
AUTOMOTIVE
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