W25Q64FVTCIF vs M25PX64SOVMF6E feature comparison

W25Q64FVTCIF Winbond Electronics Corp

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M25PX64SOVMF6E STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP STMICROELECTRONICS
Package Description TFBGA-24
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 104 MHz 75 MHz
Data Retention Time-Min 20 20
JESD-30 Code R-PBGA-B24 R-PDSO-G16
Length 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1
Number of Terminals 24 16
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA SOP
Package Equivalence Code BGA24,4X6,40 SOP16,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.00005 A 0.00001 A
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM DUAL
Width 6 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 3
Endurance 100000 Write/Erase Cycles
Supply Current-Max 0.02 mA
Type NOR TYPE

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