W25Q64FVSSIP
vs
S25FL164K0XMFIQ13
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
INFINEON TECHNOLOGIES AG
|
| Package Description |
0.208 INCH, GREEN, SOIC-8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Samacsys Manufacturer |
Winbond
|
Infineon
|
| Clock Frequency-Max (fCLK) |
104 MHz
|
|
| Data Retention Time-Min |
20
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
S-PDSO-G8
|
|
| Length |
5.28 mm
|
|
| Memory Density |
67108864 bit
|
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Number of Words |
8388608 words
|
|
| Number of Words Code |
8000000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8MX8
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP8,.3
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
SMALL OUTLINE
|
|
| Parallel/Serial |
SERIAL
|
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.16 mm
|
|
| Serial Bus Type |
SPI
|
|
| Standby Current-Max |
0.000025 A
|
|
| Supply Current-Max |
0.04 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Type |
NOR TYPE
|
|
| Width |
5.28 mm
|
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
2 Days
|
|
|
|
Compare W25Q64FVSSIP with alternatives
Compare S25FL164K0XMFIQ13 with alternatives