W25Q64FVSFIQ
vs
S25FL064A0LNFI003
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
SPANSION INC
|
| Package Description |
SOIC-16
|
0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SOP-16
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Samacsys Manufacturer |
Winbond
|
|
| Alternate Memory Width |
1
|
|
| Clock Frequency-Max (fCLK) |
104 MHz
|
50 MHz
|
| Data Retention Time-Min |
20
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
10.31 mm
|
10.3 mm
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Number of Words |
8388608 words
|
8388608 words
|
| Number of Words Code |
8000000
|
8000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8MX8
|
8MX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.64 mm
|
2.65 mm
|
| Serial Bus Type |
SPI
|
|
| Standby Current-Max |
0.00005 A
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.49 mm
|
7.5 mm
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare W25Q64FVSFIQ with alternatives
Compare S25FL064A0LNFI003 with alternatives