W25Q64FVSFIG vs SST26VF064BAT-104I/TD feature comparison

W25Q64FVSFIG Winbond Electronics Corp

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SST26VF064BAT-104I/TD Microchip Technology Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer WINBOND ELECTRONICS CORP MICROCHIP TECHNOLOGY INC
Part Package Code SOIC
Package Description SOIC-16 TBGA-24
Pin Count 16
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.B.1.A
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
Data Retention Time-Min 20
JESD-30 Code R-PDSO-G16 R-PBGA-B24
Length 10.31 mm 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 16 24
Number of Words 8388608 words 67108864 words
Number of Words Code 8000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 64MX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TBGA
Package Equivalence Code SOP16,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Seated Height-Max 2.64 mm 1.2 mm
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position DUAL BOTTOM
Width 7.49 mm 6 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 1 1
Screening Level TS 16949

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Compare SST26VF064BAT-104I/TD with alternatives