W25Q64FVSFIG vs IS25LP064-JMLE feature comparison

W25Q64FVSFIG Winbond Electronics Corp

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IS25LP064-JMLE Integrated Silicon Solution Inc

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer WINBOND ELECTRONICS CORP INTEGRATED SILICON SOLUTION INC
Part Package Code SOIC
Package Description SOIC-16 SOP,
Pin Count 16
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 104 MHz 133 MHz
Data Retention Time-Min 20
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.31 mm 10.3 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Seated Height-Max 2.64 mm 2.65 mm
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.49 mm 7.5 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 1 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Current-Max 0.14 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE

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Compare IS25LP064-JMLE with alternatives