W25Q64FVDAIQ vs W25Q64FVSSIF feature comparison

W25Q64FVDAIQ Winbond Electronics Corp

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W25Q64FVSSIF Winbond Electronics Corp

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Package Description DIP-8 SOIC-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond Winbond
Alternate Memory Width 1 1
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
Data Retention Time-Min 20 20
JESD-30 Code R-PDIP-T8 S-PDSO-G8
Length 9.27 mm 5.28 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP8,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 2.16 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.00005 A 0.00005 A
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.28 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1

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