W25Q64FVDAIP
vs
S25FL164K0XNFI013
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
INFINEON TECHNOLOGIES AG
Package Description
DIP, DIP8,.3
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Clock Frequency-Max (fCLK)
104 MHz
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T8
Length
9.27 mm
Memory Density
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
Number of Functions
1
Number of Terminals
8
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
8MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
SERIAL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
5.33 mm
Serial Bus Type
SPI
Standby Current-Max
0.000025 A
Supply Current-Max
0.04 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Type
NOR TYPE
Width
7.62 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
3
Samacsys Manufacturer
Infineon
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