W25Q64FVDAIP
vs
S25FL064LABMFN010
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WINBOND ELECTRONICS CORP
CYPRESS SEMICONDUCTOR CORP
Package Description
DIP, DIP8,.3
SOIC-8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
104 MHz
108 MHz
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T8
S-PDSO-G8
Length
9.27 mm
5.28 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
5.33 mm
2.16 mm
Serial Bus Type
SPI
Standby Current-Max
0.000025 A
Supply Current-Max
0.04 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
7.62 mm
5.28 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
2
Date Of Intro
2016-09-26
Additional Feature
IT ALSO HAVE X1 MEMORY WIDTH
Alternate Memory Width
2
JESD-609 Code
e3
Terminal Finish
MATTE TIN
Compare W25Q64FVDAIP with alternatives
Compare S25FL064LABMFN010 with alternatives