W25Q64CVZEJG vs M25P64-VME3GBA feature comparison

W25Q64CVZEJG Winbond Electronics Corp

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M25P64-VME3GBA Numonyx Memory Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP NUMONYX
Package Description HVSON, SON, SOLCC8,.3
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Clock Frequency-Max (fCLK) 80 MHz 75 MHz
JESD-30 Code R-PDSO-N8 R-PDSO-N8
Length 8 mm 10.3 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON SON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL PARALLEL
Programming Voltage 3 V 2.7 V
Screening Level AEC-Q100
Seated Height-Max 0.8 mm 2.65 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 6 mm 7.5 mm
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DFP
Pin Count 8
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Package Equivalence Code SOLCC8,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

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