W25Q32VSSI vs W25Q32DWSSIG feature comparison

W25Q32VSSI Winbond Electronics Corp

Buy Now Datasheet

W25Q32DWSSIG Winbond Electronics Corp

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP8,.3
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 80 MHz 104 MHz
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code S-PDSO-G8 R-PDSO-G8
JESD-609 Code e0
Length 5.28 mm 5.28 mm
Memory Density 33554432 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 4194304 words 524288 words
Number of Words Code 4000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX8 512KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.3 SOP8,.3
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Programming Voltage 3 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.16 mm 2.16 mm
Serial Bus Type QSPI QSPI
Supply Voltage-Max (Vsup) 3.6 V 1.95 V
Supply Voltage-Min (Vsup) 2.7 V 1.7 V
Supply Voltage-Nom (Vsup) 3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Type NOR TYPE NOR TYPE
Width 5.28 mm 5.23 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1
Data Retention Time-Min 20
Standby Current-Max 0.00002 A
Supply Current-Max 0.04 mA

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