W25Q32BVSSBG
vs
W25Q32BVSSAP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Package Description
SOIC-8
SOP, SOP8,.3
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
80 MHz
80 MHz
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
S-PDSO-G8
S-PDSO-G8
Length
5.23 mm
5.28 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX8
4MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.3
SOP8,.3
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Screening Level
AEC-Q100
Seated Height-Max
2.16 mm
2.16 mm
Serial Bus Type
QSPI
QSPI
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
5.23 mm
5.28 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Part Package Code
SOIC
Pin Count
8
Data Retention Time-Min
20
Qualification Status
Not Qualified
Standby Current-Max
0.000005 A
Supply Current-Max
0.018 mA
Compare W25Q32BVSSBG with alternatives
Compare W25Q32BVSSAP with alternatives