W25Q128FWSIP vs W25Q128JWBIQ feature comparison

W25Q128FWSIP Winbond Electronics Corp

Buy Now Datasheet

W25Q128JWBIQ Winbond Electronics Corp

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Package Description 0.208 INCH, GREEN, SOIC-8 TBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 133 MHz
JESD-30 Code S-PDSO-G8 R-PBGA-B24
Length 5.28 mm 8 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 24
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX8 16MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TBGA
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 1.8 V 1.8 V
Seated Height-Max 2.16 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position DUAL BOTTOM
Width 5.28 mm 6 mm
Base Number Matches 1 1
Date Of Intro 2019-11-07
Samacsys Manufacturer Winbond
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Package Equivalence Code BGA24,5X5,40
Peak Reflow Temperature (Cel) NOT SPECIFIED
Serial Bus Type QSPI
Standby Current-Max 0.00005 A
Supply Current-Max 0.02 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

Compare W25Q128FWSIP with alternatives

Compare W25Q128JWBIQ with alternatives