W25Q128FWBIQ
vs
F25D128QA-104HIG
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
|
| Package Description |
TBGA,
|
HVSON,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
104 MHz
|
104 MHz
|
| JESD-30 Code |
R-PBGA-B24
|
R-PDSO-N8
|
| Length |
8 mm
|
6 mm
|
| Memory Density |
134217728 bit
|
134217728 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
8
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
16MX8
|
16MX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
1.8 V
|
1.8 V
|
| Seated Height-Max |
1.2 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
1.95 V
|
2 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
6 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SON
|
| Pin Count |
|
8
|
| Package Equivalence Code |
|
SOLCC8,.25
|
| Type |
|
NOR TYPE
|
| Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare W25Q128FWBIQ with alternatives
Compare F25D128QA-104HIG with alternatives