W25Q128FVFIQ
vs
S25FL128SAGMFM001
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOIC-16
|
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.1.A
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
104 MHz
|
133 MHz
|
| Data Retention Time-Min |
20
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
10.31 mm
|
10.3 mm
|
| Memory Density |
134217728 bit
|
134217728 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
16MX8
|
16MX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.64 mm
|
2.65 mm
|
| Serial Bus Type |
SPI
|
|
| Standby Current-Max |
0.00002 A
|
|
| Supply Current-Max |
0.02 mA
|
0.1 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
7.49 mm
|
7.5 mm
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
ALSO CONFIGURABLE AS 128M X 1
|
| Alternate Memory Width |
|
2
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Write Cycle Time-Max (tWC) |
|
500 ms
|
|
|
|
Compare W25Q128FVFIQ with alternatives
Compare S25FL128SAGMFM001 with alternatives