W25Q128FVEIP
vs
N25Q128A23BF840F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
MICRON TECHNOLOGY INC
Part Package Code
SON
DFP
Package Description
8 X 6 MM, GREEN, WSON-8
8 X 6 MM, ROHS COMPLIANT, VDFPN-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Samacsys Manufacturer
Winbond
Micron
Clock Frequency-Max (fCLK)
104 MHz
108 MHz
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
Length
8 mm
8 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX8
16MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
HVSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Seated Height-Max
0.8 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
6 mm
6 mm
Base Number Matches
1
1
Pbfree Code
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
Package Equivalence Code
SOLCC8,.3
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Serial Bus Type
QSPI
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
Time@Peak Reflow Temperature-Max (s)
30
Type
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
Compare W25Q128FVEIP with alternatives
Compare N25Q128A23BF840F with alternatives