W25Q128BVFBG
vs
S25FL129P0XMFI001
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
CYPRESS SEMICONDUCTOR CORP
Package Description
SOP,
SOP-16
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
ORGANIZED AS 65,536 PAGES OF 256 BYTES; MORE THAN 20 YEAR DATA RETENTION
Clock Frequency-Max (fCLK)
104 MHz
104 MHz
Data Retention Time-Min
20
20
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
10.31 mm
10.3 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX8
16MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Seated Height-Max
2.64 mm
2.65 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
7.49 mm
7.5 mm
Write Cycle Time-Max (tWC)
15 ms
50 ms
Base Number Matches
1
1
Endurance
100000 Write/Erase Cycles
JESD-609 Code
e3
Moisture Sensitivity Level
3
Package Equivalence Code
SOP16,.4
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Serial Bus Type
SPI
Standby Current-Max
0.00001 A
Supply Current-Max
0.038 mA
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
40
Write Protection
HARDWARE/SOFTWARE
Compare W25Q128BVFBG with alternatives
Compare S25FL129P0XMFI001 with alternatives