W25Q128BVEJP
vs
W25Q128BVECP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Package Description
HVSON,
,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Samacsys Manufacturer
Winbond
Additional Feature
ORGANIZED AS 65,536 PAGES OF 256 BYTES; MORE THAN 20 YEAR DATA RETENTION
Clock Frequency-Max (fCLK)
104 MHz
Data Retention Time-Min
20
JESD-30 Code
R-PDSO-N8
Length
8 mm
Memory Density
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
Number of Functions
1
Number of Terminals
8
Number of Words
16777216 words
Number of Words Code
16000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Organization
16MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
HVSON
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
Programming Voltage
3 V
3 V
Seated Height-Max
0.8 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Type
NOR TYPE
Width
6 mm
Write Cycle Time-Max (tWC)
15 ms
Base Number Matches
1
1
Compare W25Q128BVEJP with alternatives
Compare W25Q128BVECP with alternatives