W25P16VSSI
vs
F25L16PA-50DG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
WINBOND ELECTRONICS CORP
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP8,.3
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
25 MHz
50 MHz
Data Retention Time-Min
20
20
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
S-PDSO-G8
R-PDIP-T8
JESD-609 Code
e0
Length
5.27 mm
9.27 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX8
2MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.3
DIP8,.3
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.16 mm
5 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.000005 A
0.00003 A
Supply Current-Max
0.032 mA
0.035 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
5.27 mm
7.62 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare W25P16VSSI with alternatives
Compare F25L16PA-50DG with alternatives