W24L257AK-15 vs P3C1256-15TC feature comparison

W24L257AK-15 Winbond Electronics Corp

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P3C1256-15TC Pyramid Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer WINBOND ELECTRONICS CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP TSOP
Package Description 0.300 INCH, SKINNY, PLASTIC, DIP-28 TSOP1-28
Pin Count 28 28
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T28 R-PDSO-G28
JESD-609 Code e0
Length 35.26 mm 11.811 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSOP1
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 1.1938 mm
Standby Current-Max 0.0002 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 3.63 V 3.6 V
Supply Voltage-Min (Vsup) 2.97 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.55 mm
Terminal Position DUAL DUAL
Width 7.62 mm 8 mm
Base Number Matches 1 1
Pbfree Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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