W24512AT-15
vs
KM68V512AL-LP-85L-L
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
TSOP1
|
DIP
|
| Package Description |
TSOP1-32
|
DIP,
|
| Pin Count |
32
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.B.2.B
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
15 ns
|
85 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDIP-T
|
| JESD-609 Code |
e0
|
|
| Length |
18.4 mm
|
|
| Memory Density |
524288 bit
|
524288 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
64KX8
|
64KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP1
|
DIP
|
| Package Equivalence Code |
TSSOP32,.8,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
|
| Standby Current-Max |
0.01 A
|
|
| Standby Voltage-Min |
4.5 V
|
|
| Supply Current-Max |
0.2 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
8 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare W24512AT-15 with alternatives
Compare KM68V512AL-LP-85L-L with alternatives