W24257AQ-12 vs KM68257ETG-12 feature comparison

W24257AQ-12 Winbond Electronics Corp

Buy Now Datasheet

KM68257ETG-12 Samsung Semiconductor

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP TSOP
Package Description 8 X 13.40 MM, TSOP1-28 TSOP1, TSSOP28,.53,22
Pin Count 28 28
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 12 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e0 e0
Length 11.8 mm 11.8 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Equivalence Code TSSOP28,.53,22 TSSOP28,.53,22
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.01 A 0.002 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.16 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.55 mm 0.55 mm
Terminal Position DUAL DUAL
Width 8 mm 8 mm
Base Number Matches 1 1

Compare W24257AQ-12 with alternatives

Compare KM68257ETG-12 with alternatives