W24257A-35 vs K6E0808C1E-TP15 feature comparison

W24257A-35 Winbond Electronics Corp

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K6E0808C1E-TP15 Samsung Semiconductor

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP TSOP
Package Description 0.600 INCH, PLASTIC, DIP-28 TSOP1, TSSOP28,.46,20
Pin Count 28 28
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 15 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-PDSO-G28
JESD-609 Code e0 e0
Length 37.08 mm 11.8 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSOP1
Package Equivalence Code DIP28,.6 TSSOP28,.46,20
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 1.2 mm
Standby Current-Max 0.01 A 0.0005 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.13 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.55 mm
Terminal Position DUAL DUAL
Width 15.24 mm 8 mm
Base Number Matches 1 1
Additional Feature TTL COMPATIBLE I/O

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