W24129AK-15 vs HM5-8816HB2 feature comparison

W24129AK-15 Winbond Electronics Corp

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HM5-8816HB2 Intersil Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP HARRIS SEMICONDUCTOR
Part Package Code DIP
Package Description 0.300 INCH, SKINNY, PLASTIC, DIP-28 DIP, DIP28,.6
Pin Count 28
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 70 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-XDIP-T28
JESD-609 Code e0 e0
Length 35.26 mm
Memory Density 131072 bit 131072 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 8
Number of Functions 1
Number of Ports 1
Number of Terminals 28 28
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP28,.3 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm
Standby Current-Max 0.005 A 0.00032 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.15 mA 0.931 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2

Compare W24129AK-15 with alternatives

Compare HM5-8816HB2 with alternatives