W1D256M72R8B-3.75AL-QA2
vs
W1D256M72R8B-5AP-HB1
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
DIMM
|
DIMM
|
| Package Description |
DIMM,
|
DIMM,
|
| Pin Count |
240
|
240
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Mode |
SINGLE BANK PAGE BURST
|
SINGLE BANK PAGE BURST
|
| Access Time-Max |
0.5 ns
|
0.5 ns
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
R-XDMA-N240
|
R-XDMA-N240
|
| JESD-609 Code |
e4
|
e4
|
| Length |
133.35 mm
|
133.35 mm
|
| Memory Density |
2147483648 bit
|
2147483648 bit
|
| Memory IC Type |
DDR DRAM MODULE
|
DDR DRAM MODULE
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
240
|
240
|
| Number of Words |
268435456 words
|
268435456 words
|
| Number of Words Code |
256000000
|
256000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
55 °C
|
55 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256MX8
|
256MX8
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIMM
|
DIMM
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.7 mm
|
2.7 mm
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
GOLD
|
GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
25.4 mm
|
25.4 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare W1D256M72R8B-3.75AL-QA2 with alternatives
Compare W1D256M72R8B-5AP-HB1 with alternatives