W19B320ATB7G
vs
M29DW323DT70ZE1F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
WINBOND ELECTRONICS CORP
MICRON TECHNOLOGY INC
Part Package Code
BGA
Package Description
6 X 8 MM, 0.80 MM PITCH, TFBGA-48
TFBGA,
Pin Count
48
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Alternate Memory Width
8
8
Boot Block
TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
Length
8 mm
8 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
8,63
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-20 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA48,12X18,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
8K,64K
Standby Current-Max
0.000005 A
Supply Current-Max
0.045 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Width
6 mm
6 mm
Base Number Matches
1
3
Date Of Intro
2018-01-25
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