VT162374DGG
vs
74LVTH162374GRDR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
TSSOP
BGA
Package Description
TSSOP,
PLASTIC, FBGA-54
Pin Count
48
54
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVT
LVT
JESD-30 Code
R-PDSO-G48
R-PBGA-B54
JESD-609 Code
e0
Length
12.5 mm
8 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
1
8
Number of Functions
16
2
Number of Ports
2
2
Number of Terminals
48
54
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE WITH SERIES RESISTOR
3-STATE WITH SERIES RESISTOR
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Propagation Delay (tpd)
6.2 ns
6.2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Width
6.1 mm
5.5 mm
Base Number Matches
6
1
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
160000000 Hz
Max I(ol)
0.012 A
Package Equivalence Code
BGA54,6X9,32
Packing Method
TR
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
5.3 ns
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
Compare VT162374DGG with alternatives
Compare 74LVTH162374GRDR with alternatives