VSC8664XIC-03
vs
LAN88730BMR-C-V01
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.B
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
1000000 Mbps
|
100000 Mbps
|
| JESD-30 Code |
S-PBGA-B256
|
S-PQCC-N32
|
| JESD-609 Code |
e1
|
e3
|
| Length |
17 mm
|
5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
32
|
| Number of Transceivers |
4
|
1
|
| Operating Temperature-Max |
100 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
HVQCCN
|
| Package Equivalence Code |
BGA256,16X16,40
|
LCC32,.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
2 mm
|
0.9 mm
|
| Supply Voltage-Nom |
1.2 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
MATTE TIN
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
17 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
HVQCCN,
|
| Screening Level |
|
TS 16949
|
| Supply Current-Max |
|
28.5 mA
|
|
|
|
Compare VSC8664XIC-03 with alternatives
Compare LAN88730BMR-C-V01 with alternatives