VSC8504XKS-05
vs
KSZ9031RNXVB-TRVAO
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A991.B.1
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Data Rate |
1000000 Mbps
|
1000000 Mbps
|
JESD-30 Code |
S-PBGA-B256
|
S-XQCC-N48
|
Length |
17 mm
|
7 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
48
|
Number of Transceivers |
4
|
1
|
Operating Temperature-Max |
125 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
BGA
|
HVQCCN
|
Package Equivalence Code |
BGA256,16X16,40
|
LCC48,.27SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
1.8 mm
|
1 mm
|
Supply Current-Max |
900 mA
|
|
Supply Voltage-Nom |
1 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
17 mm
|
7 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Package Description |
|
HVQCCN,
|
Date Of Intro |
|
2017-05-26
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Screening Level |
|
AEC-Q100
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare VSC8504XKS-05 with alternatives
Compare KSZ9031RNXVB-TRVAO with alternatives