VNC2-32L1C
vs
UPD350D-I/Q8XVAO
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
LQFP-32
|
QFN-28
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
FTDI Chip
|
|
| Address Bus Width |
|
|
| Bus Compatibility |
SPI; UART; USB
|
SPI
|
| Clock Frequency-Max |
12 MHz
|
|
| Data Transfer Rate-Max |
1.5 MBps
|
|
| Drive Interface Standard |
RS232; RS422; RS485
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQCC-N28
|
| Length |
7 mm
|
4 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
32
|
28
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.6 mm
|
0.9 mm
|
| Supply Voltage-Max |
1.98 V
|
1.98 V
|
| Supply Voltage-Min |
1.62 V
|
1.62 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
7 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
AEC-Q100; TS 16949
|
|
|
|
Compare VNC2-32L1C with alternatives
Compare UPD350D-I/Q8XVAO with alternatives