VIPER50BSP
vs
TNY263P
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
POWER INTEGRATIONS INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
POWER, SO-10
|
DIP,
|
| Pin Count |
10
|
8
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Additional Feature |
AUTOMATIC BURST MODE OPERATION IN STAND-BY CONDITION
|
REQUIRES AN AC SUPPLY OF 85 TO 265 V
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
POWER SUPPLY SUPPORT CIRCUIT
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
14 V
|
|
| Input Voltage-Min |
5 V
|
|
| Input Voltage-Nom |
13 V
|
|
| JESD-30 Code |
R-PDSO-G10
|
R-PDIP-T7
|
| JESD-609 Code |
e3
|
e0
|
| Length |
9.4 mm
|
9.575 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
7
|
| Output Current-Max |
5.4 A
|
0.4 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSOP
|
DIP
|
| Package Equivalence Code |
SOP10,.55FL
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.75 mm
|
|
| Surface Mount |
YES
|
NO
|
| Switcher Configuration |
SINGLE
|
SINGLE
|
| Switching Frequency-Max |
200 kHz
|
140 kHz
|
| Technology |
MOS
|
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.62 mm
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Temperature Grade |
|
AUTOMOTIVE
|
|
|
|
Compare VIPER50BSP with alternatives
Compare TNY263P with alternatives