VHK50W-Q24-S15-DIN
vs
HWE153R3
feature comparison
| Pbfree Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
CUI INC
|
SHINDENGEN ELECTRIC MANUFACTURING CO LTD
|
| Package Description |
PACKAGE-9
|
DIP, DIP30,1.9
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Date Of Intro |
2018-06-13
|
|
| Samacsys Manufacturer |
CUI Inc.
|
|
| Analog IC - Other Type |
DC-DC REGULATED POWER SUPPLY MODULE
|
DC-DC REGULATED POWER SUPPLY MODULE
|
| Input Voltage-Max |
36 V
|
36 V
|
| Input Voltage-Min |
9 V
|
18 V
|
| Input Voltage-Nom |
24 V
|
24 V
|
| JESD-30 Code |
R-MXMA-X9
|
R-XDMA-P9
|
| Length |
107.5 mm
|
|
| Load Regulation-Max |
0.2%
|
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
60 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Max |
16.5 V
|
16.5 V
|
| Output Voltage-Min |
13.5 V
|
9 V
|
| Output Voltage-Nom |
15 V
|
15 V
|
| Package Body Material |
METAL
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
UNSPECIFIED
|
PIN/PEG
|
| Terminal Position |
UNSPECIFIED
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Total Power Output-Max |
50 W
|
50 W
|
| Trim/Adjustable Output |
YES
|
YES
|
| Width |
101.8 mm
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
2
|
| Output Current-Max |
|
3.33 A
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP30,1.9
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare VHK50W-Q24-S15-DIN with alternatives
Compare HWE153R3 with alternatives