V59C1G01408QBUJ19
vs
MT47H256M4HV-3EAT:E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PROMOS TECHNOLOGIES INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
8 X 11.50 MM, FBGA-60
Pin Count
60
60
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
Length
13.65 mm
11.5 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR DRAM
DDR2 DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
268435456 words
268435456 words
Number of Words Code
256000000
256000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
Organization
256MX4
256MX4
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Access Time-Max
0.45 ns
Clock Frequency-Max (fCLK)
333 MHz
I/O Type
COMMON
Interleaved Burst Length
4,8
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
BGA60,9X11,32
Refresh Cycles
8192
Sequential Burst Length
4,8
Supply Current-Max
0.28 mA
Terminal Finish
TIN LEAD SILVER
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Compare MT47H256M4HV-3EAT:E with alternatives