V59C1G01408QAUF19E
vs
HYB18T1G400AF-5
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
PROMOS TECHNOLOGIES INC
|
INFINEON TECHNOLOGIES AG
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TFBGA,
|
TFBGA, BGA68,9X19,32
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.32
|
8542.32.00.32
|
| Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
R-XBGA-B68
|
R-PBGA-B68
|
| Length |
17 mm
|
20 mm
|
| Memory Density |
1073741824 bit
|
1073741824 bit
|
| Memory IC Type |
DDR DRAM
|
DDR2 DRAM
|
| Memory Width |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Number of Words |
268435456 words
|
268435456 words
|
| Number of Words Code |
256000000
|
256000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
95 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256MX4
|
256MX4
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Self Refresh |
YES
|
YES
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
9 mm
|
10 mm
|
| Base Number Matches |
1
|
2
|
| Access Time-Max |
|
0.6 ns
|
| Clock Frequency-Max (fCLK) |
|
200 MHz
|
| I/O Type |
|
COMMON
|
| Interleaved Burst Length |
|
4,8
|
| JESD-609 Code |
|
e1
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
BGA68,9X19,32
|
| Refresh Cycles |
|
8192
|
| Sequential Burst Length |
|
4,8
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare V59C1G01408QAUF19E with alternatives
Compare HYB18T1G400AF-5 with alternatives