V59C1512404QCLF25AI vs V59C1512404QBLF25AI feature comparison

V59C1512404QCLF25AI ProMOS Technologies Inc

Buy Now Datasheet

V59C1512404QBLF25AI ProMOS Technologies Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PROMOS TECHNOLOGIES INC PROMOS TECHNOLOGIES INC
Part Package Code DSBGA DSBGA
Package Description TFBGA, TFBGA,
Pin Count 60 60
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 0.4 ns 0.4 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60 R-PBGA-B60
Length 10.5 mm 10.5 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128MX4 128MX4
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 10 mm 10 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare V59C1512404QCLF25AI with alternatives

Compare V59C1512404QBLF25AI with alternatives