V59C1256164QAF3
vs
MT6V16M16F2-4C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PROMOS TECHNOLOGIES INC
MICRON TECHNOLOGY INC
Part Package Code
DSBGA
BGA
Package Description
ROHS COMPLIANT, MO-207, FBGA-84
FBGA-84
Pin Count
84
84
Reach Compliance Code
unknown
unknown
Access Mode
FOUR BANK PAGE BURST
BLOCK ORIENTED PROTOCOL
Access Time-Max
0.45 ns
Additional Feature
AUTO/SELF REFRESH
SELF CONTAINED REFRESH
JESD-30 Code
R-PBGA-B84
R-PBGA-B84
Length
13 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
DDR DRAM
RAMBUS DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
84
84
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
16MX16
16MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10.5 mm
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.32.00.24
JESD-609 Code
e1
Self Refresh
YES
Terminal Finish
TIN SILVER COPPER
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